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IEC 61191-1

Printed Board Assemblies - Part 1: Generic Specification - Requirements for Soldered Electrical and Electronic Assemblies Using Surface Mount and Related Assembly Technologies

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Organization: IEC
Publication Date: 1 August 1998
Status: inactive
Page Count: 98
ICS Code (Mechanical structures for electronic equipment): 31.240
scope:

This specification prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mounted and related assembly technologies. Also included are recommendations for good manufacturing processes.

Document History

IEC 61191-1
September 1, 2018
Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly...
IEC 61191-1
May 1, 2013
Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly...
IEC 61191-1
August 1, 1998
Printed Board Assemblies - Part 1: Generic Specification - Requirements for Soldered Electrical and Electronic Assemblies Using Surface Mount and Related Assembly Technologies
This specification prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mounted and related assembly...

References

This document references:
DIN EN ISO 12226-1 - Solder pastes - Part 1: Classification and test methods (ISO/DIS 12226-1:1997); German version prEN ISO 12226-1:1997
Published by DIN on May 1, 1997
A description is not available for this item.
This document references:
DIN IEC 61193-3 - Quality Assessment Systems - Part 3: Selection and use of sampling plans for Printed Board and Laminate end-product and in-process auditing (IEC 91/749/CD:2008)
Published by DIN on April 1, 2008
A description is not available for this item.
This document references:
IEC 60050-541 - AMENDMENT 1 International Electrotechnical Vocabulary – Part 541: Printed circuits
Published by IEC on February 1, 2015
A description is not available for this item.
This document references:
IEC 60721-3-1 - Classification of environmental conditions – Part 3-1: Classification of groups of environmental parameters and their severities – Storage
Published by IEC on February 1, 2018
This part of IEC 60721 classifies the groups of environmental parameters and their severities to which products together with their packaging, if any, are subjected when stored. The environmental...
This document is referenced by:
IEC/TS 62647-1 - Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 1: Preparation for a lead-free control plan
Published by IEC on August 1, 2012
This part of the IEC/TS 62647 series defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that ADHP electronic systems containing...
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