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IPC - J-STD-004

Requirements for Soldering Fluxes

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Organization: IPC
Publication Date: 1 November 2011
Status: active
Page Count: 8

Document History

J-STD-004C
January 1, 2022
Requirements for Soldering Fluxes
This standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. This standard may be used for quality control and...
J-STD-004C
January 1, 2022
Requirements for Soldering Fluxes
This standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. This standard may be used for quality control and...
J-STD-004
November 1, 2011
Requirements for Soldering Fluxes
A description is not available for this item.
J-STD-004
December 1, 2008
Requirements for Soldering Fluxes
This standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. This standard may be used for quality control and...
J-STD-004
December 1, 2008
Requirements for Soldering Fluxes
This standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. This standard may be used for quality control and...
J-STD-004
January 1, 2004
Requirements for Soldering Fluxes
This standard prescribes general requirements for the classification and testing of fluxes for high quality solder interconnections. This standard is a flux characterization, quality control, and...
J-STD-004
January 1, 1995
Requirements for Soldering Fluxes
A description is not available for this item.
J-STD-004
January 1, 1995
Requirements for Soldering Fluxes
This standard prescribes general requirements for the classification and testing of soldering fluxes for high quality interconnections. This standard is a flux characterization, quality control, and...
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References

This document references:
TM-650 2.3.32D - Flux Induced Corrosion (Copper Mirror Method)
Published by IPC on June 1, 2004
This test method is designed to determine the removal effect the flux has (if any) on the bright copper mirror film which has been vacuum deposited on clear glass.
This document references:
TM-650 2.3.32D - Flux Induced Corrosion (Copper Mirror Method)
Published by IPC on June 1, 2004
This test method is designed to determine the removal effect the flux has (if any) on the bright copper mirror film which has been vacuum deposited on clear glass.
This document references:
TM-650 2.3.35C - Halide Content, Quantitative (Chloride & Bromide)
Published by IPC on June 1, 2004
This test method is designed to determine the halide content of fluxes attributable to chlorides and bromides. The halide content is reported as the weight percentage of chloride to the solid...
This document references:
ISO 9001 - Quality management systems — Requirements
Published by ISO on September 15, 2015
This International Standard specifies requirements for a quality management system when an organization: a) needs to demonstrate its ability to consistently provide products and services that meet...
This document references:
J-STD-003 - Solderability Tests for Printed Boards
Published by IPC on April 1, 2014
This standard prescribes test methods, defect definitions, and illustrations for assessing the solderability of printed wiring board surface conductors, attachment lands, and plated-through holes...
This document is referenced by:
MIL-DTL-15514 - TELEPHONE EQUIPMENT, SOUND POWERED TELEPHONE HANDSET, HEADSET-CHEST SET, AND HEADSET-CHEST SET, NOISE ATTENUATING
Published by NPFC on July 9, 2019
Scope. This specification covers sound powered telephone handsets, headset-chest sets, and noise attenuating headset-chest sets for naval shipboard and shore use.
This document is referenced by:
IPC-D-620 - Design and Critical Process Requirements for Cable and Wiring Harnesses
Published by IPC on December 1, 2015
This document provides design and critical process requirements and technical insight that have been removed from the acceptance standards for cable and wire harness assemblies. Reference materials...
This document is referenced by:
IPC-HDBK-001 - Handbook and Guide to Supplement J-STD-001
Published by IPC on January 1, 2021
This Handbook is a companion reference to the J-STD-001 (standard) and is intended to provide supporting information. Additional detailed information can be found in documents referenced within the...
This document is referenced by:
MIL-DTL-12632 - LOUDSPEAKERS, PERMANENT MAGNET (ENCASED, 2-WATT, FUNGUS-, GUNBLAST-, AND IMMERSION-RESISTANT), GENERAL SPECIFICATION FOR
Published by NPFC on May 18, 2020
Scope. This specification covers the general requirements for 2-watt, 4-inch diameter, permanent magnet loudspeakers encased in metal cabinets. These loudspeakers are fungus-, gunblast-, and...
This document is referenced by:
MIL-DTL-28754/59 - Connectors, Electrical, Modular, Type IV, Connector, 100 Pin, Center Contact Tails on .100 Centers (Ceramic Compatible)
Published by NPFC on April 13, 2021
A description is not available for this item.
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