IPC - J-STD-004
Requirements for Soldering Fluxes
|Publication Date:||1 December 2008|
This standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. This standard may be used for quality control and procurement purposes.
The purpose of this standard is to classify and characterize tin/lead and lead-free soldering flux materials for use in electronic metallurgical interconnections for printed circuit board assembly. Soldering flux materials include the following: liquid flux, paste flux, solder paste, solder cream, and flux-coated and flux-cored solder wires and preforms. It is not the intent of this standard to exclude any acceptable flux or soldering material; however, these materials must produce the desired electrical and metallurgical interconnection. The requirements for fluxes are defined in general terms for standard classification. Appendix B has additional information that will help users understand some of the requirements of this standard. In practice, where more stringent requirements are necessary or other manufacturing processes are used, the user shall define these as additional requirements.
This document is intended to be applicable to all types of flux as used for soldering in general and to soldering in electronics particularly. The fluxes involved relate to all aspects... View More
This document is intended to be applicable to all types of flux as used for soldering in general and to soldering in electronics particularly. The fluxes involved relate to all aspects of application, such as for wave soldering, PWB fabrication, lead tinning, and reflow, and include those in solder pastes, flux-cored wire, and flux-coated preforms. Fluxes covered by this standard are intended for use in various consumer, industrial and commercial electronics soldering applications of industry and, when adopted by government, in applications on that government's electronic hardware.View Less