IPC - TM-650 2.4.36C
Rework Simulation, Plated-Through Holes for Leaded Components
|Publication Date:||1 May 2004|
This test method is used to simulate the procedures for plated-through hole (PTH) component removal and replacement, in order to determine the effects of rework on the quality and integrity of the PTH barrel and conductor foil on bare rigid or flexible printed boards. The five steps are designed to simulate initial soldering after a preconditioning bake and two subsequent replacements.