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IPC - TM-650 2.4.36C

Rework Simulation, Plated-Through Holes for Leaded Components

active, Most Current
Organization: IPC
Publication Date: 1 May 2004
Status: active
Page Count: 2
scope:

This test method is used to simulate the procedures for plated-through hole (PTH) component removal and replacement, in order to determine the effects of rework on the quality and integrity of the PTH barrel and conductor foil on bare rigid or flexible printed boards. The five steps are designed to simulate initial soldering after a preconditioning bake and two subsequent replacements.

Document History

TM-650 2.4.36C
May 1, 2004
Rework Simulation, Plated-Through Holes for Leaded Components
This test method is used to simulate the procedures for plated-through hole (PTH) component removal and replacement, in order to determine the effects of rework on the quality and integrity of the...
August 1, 1997
Rework Simulation, Plated-Through Holes for Leaded Components
A description is not available for this item.
December 1, 1987
Rework Simulation, Plated-Through Holes
A description is not available for this item.

References

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