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IPC - TM-650 2.4.36B

Rework Simulation, Plated-Through Holes for Leaded Components

inactive
Organization: IPC
Publication Date: 1 August 1997
Status: inactive
Page Count: 2

Document History

TM-650 2.4.36C
May 1, 2004
Rework Simulation, Plated-Through Holes for Leaded Components
This test method is used to simulate the procedures for plated-through hole (PTH) component removal and replacement, in order to determine the effects of rework on the quality and integrity of the...
TM-650 2.4.36B
August 1, 1997
Rework Simulation, Plated-Through Holes for Leaded Components
A description is not available for this item.
TM-650 2.4.36A
December 1, 1987
Rework Simulation, Plated-Through Holes
A description is not available for this item.

References

This document references:
A-A-59551 - WIRE, ELECTRICAL, COPPER (UNINSULATED)
Published by NPFC on October 6, 2020
This commercial item description (CID) covers the general requirements for solid, bunch-stranded, concentric-lay-stranded, and rope-lay-stranded round, uninsulated, copper conductors for use in...
This document references:
J-STD-004 - Requirements for Soldering Fluxes
Published by IPC on November 1, 2011
A description is not available for this item.
This document references:
J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Amendment 1
Published by IPC on October 1, 2017
A description is not available for this item.
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