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IPC - 9701B

Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments

active, Most Current
Organization: IPC
Publication Date: 1 February 2022
Status: active
Page Count: 24
scope:

This specification establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict field lifetime of solder attachments for the use environments and conditions of electronic assemblies.

Purpose

The purpose of this document is to provide a standardized thermal cycling characterization method and reporting procedure of surface mount solder attachment for use in the study of processes and parameters, and for analytical prediction of solder joint reliability.

Document History

9701B
February 1, 2022
Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
This specification establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be...
February 1, 2006
Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
This specification establishes specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. It further establishes different levels...
January 1, 2002
Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
This specification establishes specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. It further establishes different levels...

References

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