scope:

This standard provides requirements and recommendations for proper handling, packaging materials and methods, environmental conditions, and storage for printed boards. The requirements and recommendations are intended to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge (ESD) (when necessary), and moisture uptake. Moisture absorbed in printed board laminates expands at soldering temperatures, and in some cases, the resulting vapor pressure can cause internal delamination or excessive strain on plated-hole walls and other structures. This is especially challenging with the higher temperatures used for Pb-free soldering.

Note: This standard includes requirements for the handling, packaging and storage of printed boards and directly supersedes IPC-1601 Revision A from 2016.

This document covers all phases from the manufacture of the bare printed board, through delivery, receiving, stocking, assembly, and soldering.