UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

close
Already an Engineering360 user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your Engineering360 Experience

close
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

IPC-1602

Standard for Printed Board Handling and Storage

active, Most Current
Buy Now
Organization: IPC
Publication Date: 1 April 2020
Status: active
Page Count: 36
scope:

This standard provides requirements and recommendations for proper handling, packaging materials and methods, environmental conditions, and storage for printed boards. The requirements and recommendations are intended to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge (ESD) (when necessary), and moisture uptake. Moisture absorbed in printed board laminates expands at soldering temperatures, and in some cases, the resulting vapor pressure can cause internal delamination or excessive strain on plated-hole walls and other structures. This is especially challenging with the higher temperatures used for Pb-free soldering.

Note: This standard includes requirements for the handling, packaging and storage of printed boards and directly supersedes IPC-1601 Revision A from 2016.

This document covers all phases from the manufacture of the bare printed board, through delivery, receiving, stocking, assembly, and soldering.

Document History

IPC-1602
April 1, 2020
Standard for Printed Board Handling and Storage
This standard provides requirements and recommendations for proper handling, packaging materials and methods, environmental conditions, and storage for printed boards. The requirements and...

References

Advertisement