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IPC-4554

Specification for Immersion Tin Plating for Printed Circuit Boards

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Organization: IPC
Publication Date: 1 January 2007
Status: active
Page Count: 56
scope:

This specification sets the requirements for the use of Immersion Tin (ISn) as a surface finish for printed circuit boards. It is intended for use by supplier, manufacturer, contract manufacturer (CM) and original equipment manufacturer (OEM).

Document History

IPC-4554
January 1, 2007
Specification for Immersion Tin Plating for Printed Circuit Boards
This specification sets the requirements for the use of Immersion Tin (ISn) as a surface finish for printed circuit boards. It is intended for use by supplier, manufacturer, contract manufacturer...
IPC-4554
January 1, 2007
Specification for Immersion Tin Plating for Printed Circuit Boards
This specification sets the requirements for the use of Immersion Tin (ISn) as a surface finish for printed circuit boards. It is intended for use by supplier, manufacturer, contract manufacturer...

References

This document references:
IPC-TM-650 2.6.3.5 - Bare Board Cleanliness by Surface Insulation Resistance
Published by IPC on January 1, 2004
This test method is used to characterize the cleanliness of printed wiring board fabrication processes by determining the degradation of electrical insulation resistance under conditions of high...
This document references:
IPC-TM-650 2.4.1 - Adhesion, Tape Testing
Published by IPC on May 1, 2004
This test method uses pressure sensitive tape to determine the adhesion quality of platings, marking inks or paints, and other materials used in conjunction with Printed Boards.
This document references:
TM-650 2.6.14.1 - Electrochemical Migration Resistance Test
Published by IPC on September 1, 2000
This test method provides a means to assess the propensity for surface electrochemical migration. This test method can be used to assess soldering materials and/or processes.
This document references:
J-STD-003 - Solderability Tests for Printed Boards
Published by IPC on April 1, 2014
This standard prescribes test methods, defect definitions, and illustrations for assessing the solderability of printed wiring board surface conductors, attachment lands, and plated-through holes...
This document references:
IPC-TM-650 2.3.25 - Detection and Measurement of Ionizable Surface Contaminants by Resistivity of Solvent Extract (ROSE)
Published by IPC on November 1, 2012
1 Scope 1.1 Purpose These tests are used as process control tools; they can be used to inspect printed boards or printed board assemblies and determine if they conform to the monitoring level of the...
This document references:
J-STD-003 - Solderability Tests for Printed Boards
Published by IPC on April 1, 2014
This standard prescribes test methods, defect definitions, and illustrations for assessing the solderability of printed wiring board surface conductors, attachment lands, and plated-through holes...
This document is referenced by:
HDBK-9798 - Handbook for Press-fit Standard for Automotive Requirements and other High-Reliability Applications
Published by IPC on April 1, 2022
This document provides guidelines and supporting information for manufacturing electronic assemblies using compliant press-fit technology. The intent is to explain the ‘‘how-to’’ and ‘‘why’’...
This document is referenced by:
IPC-7093 - Design and Assembly Process Implementation for Bottom Termination Components (BTCs)
Published by IPC on October 1, 2020
This standard describes design and assembly guidance for implementing bottom termination components (BTCs). The focus of the information contained herein is on critical design, materials, assembly,...
This document is referenced by:
IPC-6012 CHINESE - Space and Military Avionics Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards
Published by IPC on April 1, 2020
A description is not available for this item.
This document is referenced by:
IPC-1602 - Standard for Printed Board Handling and Storage
Published by IPC on April 1, 2020
This standard provides requirements and recommendations for proper handling, packaging materials and methods, environmental conditions, and storage for printed boards. The requirements and...
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