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IPC - 4556

Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Circuit Boards

active
Organization: IPC
Publication Date: 1 January 2013
Status: active
Page Count: 92
scope:

Statement of Scope

This specification sets the requirements for the use of Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) as a surface finish for printed boards. This specification sets requirements for ENEPIG deposit thicknesses for applications including soldering, wire bonding and as a contact finish. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers (OEM).

Document History

January 1, 2016
Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
A description is not available for this item.
4556
January 1, 2013
Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
Statement of Scope This specification sets the requirements for the use of Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) as a surface finish for printed boards. This...

References

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