IPC - 4556
Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
|Publication Date:||1 January 2013|
Statement of Scope
This specification sets the requirements for the use of Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) as a surface finish for printed boards. This specification sets requirements for ENEPIG deposit thicknesses for applications including soldering, wire bonding and as a contact finish. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers (OEM).