Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
|Publication Date:||1 July 2016|
Statement of Scope
This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or without buried/blind vias, and metal cores. The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017. The printed board may contain build up High Density Interconnect (HDI) layers.
Purpose The purpose of this specification is to provide requirements for qualification and performance of high frequency (microwave) printed boards.