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IPC-6018

Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

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Organization: IPC
Publication Date: 1 July 2016
Status: active
Page Count: 64
scope:

Statement of Scope

This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or without buried/blind vias, and metal cores. The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017. The printed board may contain build up High Density Interconnect (HDI) layers.

Purpose The purpose of this specification is to provide requirements for qualification and performance of high frequency (microwave) printed boards.

Document History

6018D
February 1, 2022
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or...
IPC-6018
July 1, 2016
Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
This addendum provides requirements to be used in addition to, and in some cases, in place of, those published in IPC-6018C to ensure the reliability of printed boards that must survive the...
IPC-6018
July 1, 2016
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
Statement of Scope This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline...
IPC-6018
November 1, 2011
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or...
IPC-6018
January 1, 2002
Microwave End Product Board Inspection and Test
This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or...
IPC-6018
January 1, 1998
Microwave End Product Board Inspection and Test
This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, hybrid and multilayer stripline applications.
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References

This document references:
IPC-SM-840 - Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
Published by IPC on December 1, 2010
This specification shall define the criteria for and method of obtaining the maximum information about and confidence in cured permanent solder mask material under evaluation with the minimum of test...
This document references:
T-50N - Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Published by IPC on November 1, 2021
This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing...
This document references:
IPC-CF-152 - Composite Metallic Material Specification for Printed Wiring Board
Published by IPC on December 1, 1997
This specification covers the requirements for copper/invar/copper (CIC), copper/molybdenum/copper (CMC), three-layer composite. The CIC material consists of copper bonded to each side of a layer of...
This document references:
ASME B46.1 - Surface Texture (Surface Roughness, Waviness, and Lay)
Published by ASME on January 1, 2019
This Standard is concerned with the geometric irregularities of surfaces. It defines surface texture and its constituents: roughness, waviness, and lay. It also defines parameters for specifying...
This document references:
ASQ H1331 - Zero Acceptance Number Sampling Plans
Published by ASQ on January 1, 2008
A description is not available for this item.
This document references:
IPC-SM-840 - Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
Published by IPC on December 1, 2010
This specification shall define the criteria for and method of obtaining the maximum information about and confidence in cured permanent solder mask material under evaluation with the minimum of test...
This document is referenced by:
PREN 16602-70-60 - Space product assurance - Qualification and Procurement of printed circuit boards
Published by CEN on September 1, 2017
This standard specifies the requirements for the PCB manufacturer, the procurement authority and the qualification authority for qualification and procurement of PCB technology. ECSS-Q-ST-70-60 is...
This document is referenced by:
KSC-DE-512-SM REV M - GROUND SYSTEMS DEVELOPMENT STANDARD
Published by KSC on November 9, 2021
Purpose This document establishes requirements and guidance for the design and fabrication of ground systems (GS), which includes ground support equipment (GSE) and ground support systems (GSS), to...
This document is referenced by:
SMC-S-010 - Technical Requirements for Electronic Parts, Materials, and Processes Used in Space Vehicles
Published by AIR FORCE on April 12, 2013
PURPOSE. This document establishes the minimum technical requirements for electronic parts, materials, and processes (electronic PMP) used in the design, development, and fabrication of space and...
This document is referenced by:
IPC-TM-650 2.6.27 - Thermal Stress, Convection Reflow Assembly Simulation
Published by IPC on February 1, 2020
This method is intended to simulate exposure to the thermal conditions by convection reflow assembly. Purpose This method shall be used to replicate the thermodynamic effects by assembly on the test...
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