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IPC-6018

Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

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Organization: IPC
Publication Date: 1 November 2011
Status: inactive
Page Count: 56
scope:

This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or without buried/blind vias, and metal cores.

The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017. The printed board may contain build up High Density Interconnect (HDI) layers conforming to IPC-6016.

Purpose The purpose of this specification is to provide requirements for qualification and performance of high frequency (Microwave) printed boards.

Document History

6018DS
August 1, 2022
Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
This addendum provides requirements to be used in addition to, and in some cases, in place of, those published in IPC-6018D to ensure the reliability of printed boards that must survive the...
6018D
February 1, 2022
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or...
IPC-6018
July 1, 2016
Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
This addendum provides requirements to be used in addition to, and in some cases, in place of, those published in IPC-6018C to ensure the reliability of printed boards that must survive the...
IPC-6018
July 1, 2016
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
Statement of Scope This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline...
IPC-6018
November 1, 2011
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or...
IPC-6018
January 1, 2002
Microwave End Product Board Inspection and Test
This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or...
IPC-6018
January 1, 1998
Microwave End Product Board Inspection and Test
This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, hybrid and multilayer stripline applications.
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References

This document references:
TM-650 2.4.18.1A - Tensile Strength and Elongation, In-House Plating
Published by IPC on May 1, 2004
To determine the tensile strength in Mpa (PSI) and the elongation, in percentage, of electrodeposited copper plating at ambient temperatures by mechanical force testing.
This document references:
IPC-TM-650 2.4.28.1 - Solder Mask Adhesion - Tape Test Method
Published by IPC on March 1, 2007
This test method defines the procedure for determining the adhesion of solder resists (masks) used over melting metals, (such as solder plated and reflowed solder printed boards both prior to and...
This document references:
IPC-TM-650 2.5.7 - Dielectric Withstanding Voltage, PCB
Published by IPC on May 1, 2004
The dielectric withstanding voltage test (also called high-potential, over potential, voltage breakdown, or dielectric strength test) consists of the application of a voltage higher than rated...
This document references:
IPC-4553 - Specification for Immersion Silver Plating for Printed Boards
Published by IPC on May 1, 2009
Statement of Scope This specification sets the requirements for the use of Immersion Silver (IAg) as a surface finish for printed circuit boards. This specification is intended to set requirements...
This document references:
IPC-4563 - Resin Coated Copper Foil for Printed Boards Guideline
Published by IPC on November 1, 2007
This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies.
This document is referenced by:
NASA-STD-5005 REV D W/CHG 1 - STANDARD FOR THE DESIGN AND FABRICATION OF GROUND SUPPORT EQUIPMENT
Published by NASA on June 14, 2013
Purpose The purpose of this Standard is to establish requirements and guidance for design and fabrication of ground support equipment (GSE) to assist National Aeronautics and Space Administration...
This document is referenced by:
MIL-HDBK-2036 VALID NOTICE 1 - Electronic Equipment Specifications, Preparation of
Published by NAVY on June 3, 2022
A description is not available for this item.
This document is referenced by:
IEC PAS 61249-8-5 - Qualification and performance specification of permanent solder mask and flexible cover materials
Published by IEC on June 1, 2014
This specification shall define the criteria for and method of obtaining the maximum information about and confidence in cured permanent solder mask and cover material under evaluation with the...
This document supersedes:
IPC-6012 - Medical Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards
Published by IPC on August 1, 2020
This Specification covers qualification and performance requirements of Rigid Printed Board for Medical Device Applications. The Printed Boards may have a design that contains HDI and Design Level D...
This document supersedes:
IPC-6012 - Medical Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards
Published by IPC on August 1, 2020
This Specification covers qualification and performance requirements of Rigid Printed Board for Medical Device Applications. The Printed Boards may have a design that contains HDI and Design Level D...
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