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IPC-4563

Resin Coated Copper Foil for Printed Boards Guideline

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Organization: IPC
Publication Date: 1 November 2007
Status: active
Page Count: 28
scope:

This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies.

Document History

IPC-4563
November 1, 2007
Resin Coated Copper Foil for Printed Boards Guideline
This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies.

References

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