UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

close
Already an Engineering360 user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your Engineering360 Experience

close
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

DOD - DSCC-DWG-10012

PRINTED WIRING BOARD, RIGID, MULTILAYERED, GENERAL DRAWING

active, Most Current
Buy Now
Organization: DOD
Publication Date: 29 February 2012
Status: active
Page Count: 9
scope:

This drawing describes the requirements for a family of rigid multilayered printed wiring boards that contain plated through holes. Some design may also have blind vias, buried vias, or a combination of both. Printed wiring boards conforming to this drawing can be used for qualification to Department of Defense performance specifications.

intended Use:

Printed wiring boards conforming to this drawing are intended to be evaluated to the qualification requirements of MIL-PRF-55110.

Document History

DSCC-DWG-10012
February 29, 2012
PRINTED WIRING BOARD, RIGID, MULTILAYERED, GENERAL DRAWING
This drawing describes the requirements for a family of rigid multilayered printed wiring boards that contain plated through holes. Some design may also have blind vias, buried vias, or a combination...

References

Advertisement