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IPC - 6018D

Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

active
Organization: IPC
Publication Date: 1 February 2022
Status: active
Page Count: 60
scope:

This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or without buried/blind vias, and metal cores.

The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017. The printed board may contain build up High Density Interconnect (HDI) layers.

Purpose

The purpose of this specification is to provide requirements for qualification and performance of high frequency (microwave) printed boards.

Document History

6018DS
August 1, 2022
Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
This addendum provides requirements to be used in addition to, and in some cases, in place of, those published in IPC-6018D to ensure the reliability of printed boards that must survive the...
6018D
February 1, 2022
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or...
IPC-6018
July 1, 2016
Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
This addendum provides requirements to be used in addition to, and in some cases, in place of, those published in IPC-6018C to ensure the reliability of printed boards that must survive the...
IPC-6018
July 1, 2016
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
Statement of Scope This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline...
IPC-6018
November 1, 2011
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or...
IPC-6018
January 1, 2002
Microwave End Product Board Inspection and Test
This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or...
IPC-6018
January 1, 1998
Microwave End Product Board Inspection and Test
This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, hybrid and multilayer stripline applications.
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References

This document references:
ASME B46.1 - Surface Texture (Surface Roughness, Waviness, and Lay)
Published by ASME on January 1, 2019
This Standard is concerned with the geometric irregularities of surfaces. It defines surface texture and its constituents: roughness, waviness, and lay. It also defines parameters for specifying...
This document references:
ASQ H1331 - Zero Acceptance Number Sampling Plans
Published by ASQ on January 1, 2008
A description is not available for this item.
This document references:
ASQ Z1.4 - SAMPLING PROCEDURES AND TABLES FOR INSPECTION BY ATTRIBUTES
Published by ASQ on January 1, 2003
PURPOSE. This publication establishes sampling plans and procedures for inspection by attributes. When specified by the responsible authority, this publication shall be referenced in the...
This document references:
ASTM B152/B152M - Standard Specification for Copper Sheet, Strip, Plate, and Rolled Bar
Published by ASTM on October 1, 2019
This specification2 establishes the requirements for copper sheet, strip, plate, and rolled bar produced from the following coppers. NOTE 1—Each of the coppers listed has unique properties that can...
This document references:
ASTM B488 - Standard Specification for Electrodeposited Coatings of Gold for Engineering Uses
Published by ASTM on August 1, 2018
This specification covers requirements for electrodeposited gold coatings that contain not less than 99.00 mass % gold and that are used for engineering applications. Specifically excluded from this...
This document is referenced by:
2228 - Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
Published by IPC on October 1, 2022
This standard establishes the specific requirements for the design of rigid, flexible and rigid-flexible printed boards utilizing radio frequency (RF) and/or Microwave circuity and/or high frequency...
This document is referenced by:
NASA-STD-5005 REV D W/CHG 1 - STANDARD FOR THE DESIGN AND FABRICATION OF GROUND SUPPORT EQUIPMENT
Published by NASA on June 14, 2013
Purpose The purpose of this Standard is to establish requirements and guidance for design and fabrication of ground support equipment (GSE) to assist National Aeronautics and Space Administration...
This document is referenced by:
KSC-DE-512-SM REV M - GROUND SYSTEMS DEVELOPMENT STANDARD
Published by KSC on November 9, 2021
Purpose This document establishes requirements and guidance for the design and fabrication of ground systems (GS), which includes ground support equipment (GSE) and ground support systems (GSS), to...
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