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IPC-6018

Microwave End Product Board Inspection and Test

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Organization: IPC
Publication Date: 1 January 2002
Status: inactive
Page Count: 44
scope:

This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or without buried/blind vias, and metal cores.

Document History

6018DS
August 1, 2022
Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
This addendum provides requirements to be used in addition to, and in some cases, in place of, those published in IPC-6018D to ensure the reliability of printed boards that must survive the...
6018D
February 1, 2022
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or...
IPC-6018
July 1, 2016
Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
This addendum provides requirements to be used in addition to, and in some cases, in place of, those published in IPC-6018C to ensure the reliability of printed boards that must survive the...
IPC-6018
July 1, 2016
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
Statement of Scope This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline...
IPC-6018
November 1, 2011
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or...
IPC-6018
January 1, 2002
Microwave End Product Board Inspection and Test
This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or...
IPC-6018
January 1, 1998
Microwave End Product Board Inspection and Test
This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, hybrid and multilayer stripline applications.
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References

This document references:
IPC-6011 - Generic Performance Specification for Printed Boards
Published by IPC on July 1, 1996
Statement of Scope This specification establishes the general requirements for printed boards and the quality and reliability assurance requirements that must be met for their acquisition. The intent...
This document references:
IPC-6015 - Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures
Published by IPC on February 1, 1998
This specification establishes the specific requirements for the organic mounting structure used to interconnect chip components, which in combination form the completed functional Organic...
This document references:
IPC-9191 - General Guidelines for Implementation of Statistical Process Control (SPC)
Published by IPC on November 1, 1999
This guideline describes the general provisions for implementation of SPC and is intended for use by individuals in electronics and other industries involved in the planning, implementation, and...
This document is referenced by:
IPC-TM-650 2.6.27 - Thermal Stress, Convection Reflow Assembly Simulation
Published by IPC on February 1, 2020
This method is intended to simulate exposure to the thermal conditions by convection reflow assembly. Purpose This method shall be used to replicate the thermodynamic effects by assembly on the test...
This document is referenced by:
IPC-4781 - Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Inks
Published by IPC on May 1, 2008
This specification shall define the criteria for and method of obtaining the maximum information about and confidence in legend and marking ink material under evaluation. This specification covers...
This document is referenced by:
IPC-4554 - Specification for Immersion Tin Plating for Printed Circuit Boards
Published by IPC on January 1, 2007
This specification sets the requirements for the use of Immersion Tin (ISn) as a surface finish for printed circuit boards. It is intended for use by supplier, manufacturer, contract manufacturer...
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