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IPC-4556

Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Circuit Boards

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Organization: IPC
Publication Date: 1 January 2016
Status: active
Page Count: 9

Document History

IPC-4556
January 1, 2016
Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
A description is not available for this item.
IPC-4556
January 1, 2013
Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
Statement of Scope This specification sets the requirements for the use of Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) as a surface finish for printed boards. This...

References

This document references:
IPC-2221 - Generic Standard on Printed Board Design
Published by IPC on June 1, 2018
A description is not available for this item.
This document references:
IPC-TM-650 2.4.1 - Adhesion, Tape Testing
Published by IPC on May 1, 2004
This test method uses pressure sensitive tape to determine the adhesion quality of platings, marking inks or paints, and other materials used in conjunction with Printed Boards.
This document is referenced by:
IPC-6018 - Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
Published by IPC on July 1, 2016
Statement of Scope This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline...
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