Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
|Publication Date:||1 January 2002|
This specification establishes specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. It further establishes different levels of performance and reliability of the solder attachments of surface mount devices to rigid, flexible and rigid-flex circuit structures. In addition, it provides an approximate means of relating the results from these performance tests to the reliability of solder attachments for the use environments and conditions of electronic assemblies.
The purpose of this document is:
• To provide confidence that the design and the manufacturing/assemb
• To permit the analytical prediction of reliability based on a generic database and technical understanding.
• To provide standardized test methods and reporting procedures.
This specification recognizes that surface mount assemblies (SMAs) will be subject to variations in performance requirements based on end use. While Performance Classes are defined in IPC-6011, Generic Performance Specification for Printed Boards, these performance classifications are not specific as to the required reliability. At this point in time, the reliability requirements need to be established by agreement between customer and supplier.
Definition of Terms
The definition of all terms used herein shall be as specified in IPC-T-50, except as otherwise specified in Section 3.
"Shall," the imperative form of the verb, is used throughout this specification whenever a requirement is intended to express a provision that is mandatory. Deviation from a "shall" requirement may be considered if sufficient data is supplied to justify the exception.
The words "should" and "may" are used whenever it is necessary to express non-mandatory provisions. "Will" is used to express a declaration of purpose."
To assist the reader, the word "shall" is presented in bold characters.