scope:

This document describes a test method only; acceptance criteria and qualification requirements are not defined. This test method applies to solder ball shear force/energy testing prior to end-use attachment. Solder balls are sheared individually; force, fracture energy and failure mode data are collected and analyzed. Both low- and high-speed testing are covered by this document.

Depending on test sample configuration, application, and purpose of the test (characterization, qualification, production, etc.), other solder joint integrity assessment methods such as JEDEC Solder Ball Pull Test Method JESD22-B115, may be more appropriate. Generally, solder ball shear is most appropriate for devices that experience shear loading during either the manufacturing/shipment process, or end use.

This test method is used to assess the ability of solder balls to withstand mechanical shear forces that may be applied during device manufacturing, handling, test, shipment, and end-use conditions. Solder ball shear is a destructive test. This test method provides qualitative results and is suitable for process and material characterization.