JEDEC JESD 22-B117
Solder Ball Shear
inactive
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| Organization: | JEDEC |
| Publication Date: | 1 October 2006 |
| Status: | inactive |
| Page Count: | 16 |
scope:
The purpose of this test is conducted to assess the ability of solder balls to withstand mechanical shear forces that may be applied during device manufacturing, handling, test, shipment and end-use conditions. Solder ball shear is a destructive test.
Document History
May 1, 2014
Solder Ball Shear
This document describes a test method only; acceptance criteria and qualification requirements are not defined. This test method applies to solder ball shear force/energy testing prior to end-use...
JEDEC JESD 22-B117
October 1, 2006
Solder Ball Shear
The purpose of this test is conducted to assess the ability of solder balls to withstand mechanical shear forces that may be applied during device manufacturing, handling, test, shipment and end-use...
References
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