UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

close
Already an Engineering360 user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your Engineering360 Experience

close
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

IPC - TM-650 2.4.13F

Solder Float Resistance Flexible Printed Wiring Materials

active, Most Current
Organization: IPC
Publication Date: 1 May 1998
Status: active
Page Count: 1
scope:

This test method establishes and defines the procedures for determining the solder float resistance of copper foil clad and bare flexible dielectric material.

Document History

TM-650 2.4.13F
May 1, 1998
Solder Float Resistance Flexible Printed Wiring Materials
This test method establishes and defines the procedures for determining the solder float resistance of copper foil clad and bare flexible dielectric material.
May 1, 1988
Solder Float Resistance Flexible Printed Wiring Materials
A description is not available for this item.

References

Advertisement