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IPC - TM-650 2.4.13F

Solder Float Resistance Flexible Printed Wiring Materials

active, Most Current
Organization: IPC
Publication Date: 1 May 1998
Status: active
Page Count: 1
scope:

This test method establishes and defines the procedures for determining the solder float resistance of copper foil clad and bare flexible dielectric material.

Document History

TM-650 2.4.13F
May 1, 1998
Solder Float Resistance Flexible Printed Wiring Materials
This test method establishes and defines the procedures for determining the solder float resistance of copper foil clad and bare flexible dielectric material.
TM-650 2.4.13E
May 1, 1988
Solder Float Resistance Flexible Printed Wiring Materials
A description is not available for this item.

References

This document references:
J-STD-004 - Requirements for Soldering Fluxes
Published by IPC on November 1, 2011
A description is not available for this item.
This document is referenced by:
IPC-4204 - Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
Published by IPC on August 1, 2018
This standard establishes the classification system, the qualification and quality conformance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible...
This document is referenced by:
IPC-4203 - Cover and Bonding Material for Flexible Printed Circuitry
Published by IPC on March 1, 2018
This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as...
This document is referenced by:
TM-650 2.6.21B - Service Temperature of Metal-Clad Flexible Laminate, Cover Material and Adhesive Bonding Films
Published by IPC on June 1, 2011
A description is not available for this item.
This document is referenced by:
MIL-PRF-55110 - PRINTED WIRING BOARD, RIGID, GENERAL SPECIFICATION FOR
Published by NPFC on May 16, 2020
Scope. This specification establishes the performance and qualification requirements for rigid single-sided, double-sided, and multilayered printed wiring boards with or without plated through holes...
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