IPC - TM-650 2.4.13E
Solder Float Resistance Flexible Printed Wiring Materials
inactive
Organization: | IPC |
Publication Date: | 1 May 1988 |
Status: | inactive |
Page Count: | 2 |
Document History

May 1, 1998
Solder Float Resistance Flexible Printed Wiring Materials
This test method establishes and defines the procedures for determining the solder float resistance of copper foil clad and bare flexible dielectric material.

TM-650 2.4.13E
May 1, 1988
Solder Float Resistance Flexible Printed Wiring Materials
A description is not available for this item.