Cover and Bonding Material for Flexible Printed Circuitry
|Publication Date:||1 March 2018|
This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, and supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry. It does not cover non-flexible adhesives designed to be used in the rigid board areas of rigid flex constructions, which are covered in IPC-4101. Materials such as liquid-applied covercoat (see 22.214.171.124) are covered in IPC-SM-840 and are excluded from this document.
This specification supersedes both IPC-FC-232C and IPC-FC-233A and the requirements herein meet or exceed the requirements for Class 3 in these superseded documents. Note that conformance to Class 3 meets or exceeds conformance to Classes 1 and 2. IPC-4203 no longer utilizes the 3-class system.