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IPC-4202

Flexible Base Dielectrics for Use in Flexible Printed Boards

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Organization: IPC
Publication Date: 1 December 2016
Status: active
Page Count: 40
scope:

This standard establishes the classification system, the qualification and quality conformance requirements for flexible base dielectric materials to be used for the fabrication of flexible printed boards. This specification supersedes IPC-4202 which, in turn superseded IPC-FC-231C and the requirements herein meet or exceed the requirements for Class 3 in this superseded document. Note that conformance to Class 3 met or exceeded conformance to Classes 1 and 2. IPC-4202 no longer utilizes the 3-class system.

Document History

4202C
January 1, 2022
Specification for Flexible Base Dielectrics for Use in Flexible Printed Boards
This standard establishes the classification system, the qualification and quality conformance requirements for flexible base dielectric materials to be used for the fabrication of flexible printed...
IPC-4202
December 1, 2016
Flexible Base Dielectrics for Use in Flexible Printed Boards
This standard establishes the classification system, the qualification and quality conformance requirements for flexible base dielectric materials to be used for the fabrication of flexible printed...
IPC-4202
March 1, 2014
Flexible Base Dielectrics for Use in Flexible Printed Circuitry
A description is not available for this item.
IPC-4202
April 1, 2010
Flexible Base Dielectrics for Use in Flexible Printed Circuitry
This standard establishes the classification system, the qualification and quality conformance requirements for flexible base dielectric materials to be used for the fabrication of flexible printed...
IPC-4202
April 1, 2010
Flexible Base Dielectrics for Use in Flexible Printed Circuitry
A description is not available for this item.
IPC-4202
May 1, 2002
Flexible Base Dielectrics for Use in Flexible Printed Circuitry
This standard establishes the classification system, the qualification and quality conformance requirements for flexible base dielectric materials to be used for the fabrication of flexible printed...
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References

This document references:
ASTM D149 - Standard Test Method for Dielectric Breakdown Voltage and Dielectric Strength of Solid Electrical Insulating Materials at Commercial Power Frequencies
Published by ASTM on January 1, 2020
This test method covers procedures for the determination of dielectric strength of solid insulating materials at commercial power frequencies, under specified conditions.2,3 Unless otherwise...
This document references:
ASTM D2520 - Standard Test Methods for Complex Permittivity (Dielectric Constant) of Solid Electrical Insulating Materials at Microwave Frequencies and Temperatures to 1650 Degrees C
Published by ASTM on May 1, 2013
These test methods cover the determination of relative (Note 1) complex permittivity (dielectric constant and dissipation factor) of nonmagnetic solid dielectric materials. NOTE 1—The word "relative"...
This document references:
D374/D374M - Standard Test Methods for Thickness of Solid Electrical Insulation
October 1, 2023
These test methods cover the determination of the thickness of several types of solid electrical insulating materials employing recommended techniques. Use these test methods except as otherwise...
This document references:
IPC-9191 - General Guidelines for Implementation of Statistical Process Control (SPC)
Published by IPC on November 1, 1999
This guideline describes the general provisions for implementation of SPC and is intended for use by individuals in electronics and other industries involved in the planning, implementation, and...
This document references:
T-50N - Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Published by IPC on November 1, 2021
This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing...
This document is referenced by:
IPC-6013 - Qualification and Performance Specification for Flexible and Rigid-Flexible Printed Boards
Published by IPC on April 1, 2018
A description is not available for this item.
This document is referenced by:
7091A - Design and Assembly Process Implementation of 3D Components
Published by IPC on January 1, 2023
This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the effects of combining multiple uncased...
This document is referenced by:
IPC-2292 - Design Standard for Printed Electronics on Flexible Substrates
Published by IPC on March 1, 2018
This standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on flexible substrates. Flexible...
This document is referenced by:
IPC-4203 - Cover and Bonding Material for Flexible Printed Circuitry
Published by IPC on March 1, 2018
This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as...
This document is referenced by:
6012F (REDLINE + STANDARD) - Qualification and Performance Specification for Rigid Printed Boards
Published by IPC on September 1, 2023
A description is not available for this item.
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