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IPC-4202

Flexible Base Dielectrics for Use in Flexible Printed Circuitry

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Organization: IPC
Publication Date: 1 April 2010
Status: inactive
Page Count: 36
scope:

This standard establishes the classification system, the qualification and quality conformance requirements for flexible base dielectric materials to be used for the fabrication of flexible printed circuitry and flexible flat cable. This specification supersedes IPC-4202 which, in turn superseded IPC-FC-231C and the requirements herein meet or exceed the requirements for Class 3 in this superseded document. Note that conformance to Class 3 met or exceeded conformance to Classes 1 and 2. IPC-4202 no longer utilizes the 3-class system.

Document History

4202C
January 1, 2022
Specification for Flexible Base Dielectrics for Use in Flexible Printed Boards
This standard establishes the classification system, the qualification and quality conformance requirements for flexible base dielectric materials to be used for the fabrication of flexible printed...
IPC-4202
December 1, 2016
Flexible Base Dielectrics for Use in Flexible Printed Boards
This standard establishes the classification system, the qualification and quality conformance requirements for flexible base dielectric materials to be used for the fabrication of flexible printed...
IPC-4202
March 1, 2014
Flexible Base Dielectrics for Use in Flexible Printed Circuitry
A description is not available for this item.
IPC-4202
April 1, 2010
Flexible Base Dielectrics for Use in Flexible Printed Circuitry
This standard establishes the classification system, the qualification and quality conformance requirements for flexible base dielectric materials to be used for the fabrication of flexible printed...
IPC-4202
April 1, 2010
Flexible Base Dielectrics for Use in Flexible Printed Circuitry
A description is not available for this item.
IPC-4202
May 1, 2002
Flexible Base Dielectrics for Use in Flexible Printed Circuitry
This standard establishes the classification system, the qualification and quality conformance requirements for flexible base dielectric materials to be used for the fabrication of flexible printed...
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References

This document references:
ASTM D149 - Standard Test Method for Dielectric Breakdown Voltage and Dielectric Strength of Solid Electrical Insulating Materials at Commercial Power Frequencies
Published by ASTM on January 1, 2020
This test method covers procedures for the determination of dielectric strength of solid insulating materials at commercial power frequencies, under specified conditions.2,3 Unless otherwise...
This document references:
IPC-9191 - General Guidelines for Implementation of Statistical Process Control (SPC)
Published by IPC on November 1, 1999
This guideline describes the general provisions for implementation of SPC and is intended for use by individuals in electronics and other industries involved in the planning, implementation, and...
This document references:
TM-650 2.5.5.9 - Permittivity and Loss Tangent, Parallel Plate, 1 MHz to 1.5 GHz
Published by IPC on November 1, 1998
This procedure outlines a test method to determine the permittivity (dielectric constant or E'r) and loss tangent (dissipation factor or Tand) of printed wiring materials at various frequencies (from...
This document is referenced by:
DSCC-DWG-11006 - PRINTED WIRING BOARD, FLEXIBLE AND RIGID FLEX, GENERAL DRAWING
Published by DOD on October 13, 2012
This drawing describes the requirements for a family of flexible and rigid–flex printed wiring boards that contain plated through holes. Some design may also have blind vias, buried vias, or a...
This document is referenced by:
IPC-2221 - Generic Standard on Printed Board Design
Published by IPC on June 1, 2018
A description is not available for this item.
This document is referenced by:
IPC-4203 - Cover and Bonding Material for Flexible Printed Circuitry
Published by IPC on March 1, 2018
This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as...
This document is referenced by:
IPC-4204 - Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
Published by IPC on August 1, 2018
This standard establishes the classification system, the qualification and quality conformance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible...
This document is referenced by:
IPC-2221 CHINESE - Generic Standard on Printed Board Design
Published by IPC on May 1, 2003
This standard establishes the generic requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures. The organic materials may be...
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