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IPC - 4202C

Specification for Flexible Base Dielectrics for Use in Flexible Printed Boards

active, Most Current
Organization: IPC
Publication Date: 1 January 2022
Status: active
Page Count: 36
scope:

This standard establishes the classification system, the qualification and quality conformance requirements for flexible base dielectric materials to be used for the fabrication of flexible printed boards.

Document History

4202C
January 1, 2022
Specification for Flexible Base Dielectrics for Use in Flexible Printed Boards
This standard establishes the classification system, the qualification and quality conformance requirements for flexible base dielectric materials to be used for the fabrication of flexible printed...
IPC-4202
December 1, 2016
Flexible Base Dielectrics for Use in Flexible Printed Boards
This standard establishes the classification system, the qualification and quality conformance requirements for flexible base dielectric materials to be used for the fabrication of flexible printed...
IPC-4202
March 1, 2014
Flexible Base Dielectrics for Use in Flexible Printed Circuitry
A description is not available for this item.
IPC-4202
April 1, 2010
Flexible Base Dielectrics for Use in Flexible Printed Circuitry
This standard establishes the classification system, the qualification and quality conformance requirements for flexible base dielectric materials to be used for the fabrication of flexible printed...
IPC-4202
April 1, 2010
Flexible Base Dielectrics for Use in Flexible Printed Circuitry
A description is not available for this item.
IPC-4202
May 1, 2002
Flexible Base Dielectrics for Use in Flexible Printed Circuitry
This standard establishes the classification system, the qualification and quality conformance requirements for flexible base dielectric materials to be used for the fabrication of flexible printed...
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References

This document references:
IPC-9191 - General Guidelines for Implementation of Statistical Process Control (SPC)
Published by IPC on November 1, 1999
This guideline describes the general provisions for implementation of SPC and is intended for use by individuals in electronics and other industries involved in the planning, implementation, and...
This document references:
T-50N - Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Published by IPC on November 1, 2021
This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing...
This document references:
TM-650 2.1.13B - Inspection for Voids in Flexible Printed Board Materials
Published by IPC on May 1, 2012
A description is not available for this item.
This document references:
IPC-TM-650 2.2.4 - Dimensional Stability, Flexible Dielectric Materials
Published by IPC on May 1, 1998
This test method is used to establish and define the procedures for determining thermal gradient dimensional changes of a plastic dielectric, metal clad or unclad. This method may also be used to...
This document references:
TM-650 2.3.2G - Chemical Resistance of Flexible Printed Board Materials
Published by IPC on December 1, 2007
To determine the effect of chemicals used in printed board fabrication on metal-clad and bare flexible dielectric materials. Caution: This test method uses hazardous chemicals to generate data. The...
This document is referenced by:
2228 - Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
Published by IPC on October 1, 2022
This standard establishes the specific requirements for the design of rigid, flexible and rigid-flexible printed boards utilizing radio frequency (RF) and/or Microwave circuity and/or high frequency...
This document is referenced by:
IPC-2292 - Design Standard for Printed Electronics on Flexible Substrates
Published by IPC on March 1, 2018
This standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on flexible substrates. Flexible...
This document is referenced by:
7091A - Design and Assembly Process Implementation of 3D Components
Published by IPC on January 1, 2023
This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the effects of combining multiple uncased...
This document is referenced by:
8952 - Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles
Published by IPC on December 1, 2022
This standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on coated or treated textile...
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