IPC - TM-650 2.1.13B
Inspection for Voids in Flexible Printed Board Materials
active, Most Current
Organization: | IPC |
Publication Date: | 1 May 2012 |
Status: | active |
Page Count: | 1 |
Document History

TM-650 2.1.13B
May 1, 2012
Inspection for Voids in Flexible Printed Board Materials
A description is not available for this item.

May 1, 1998
Inspection for Inclusions and Voids in Flexible Printed Wiring Materials
This method describes a procedure for quantifying the presence of inclusions and voids in flexible printed wiring materials.

July 1, 1993
Inspection for Inclusions and Voids in Flexible Printed Wiring Materials
A description is not available for this item.