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IPC - TM-650 2.1.13B

Inspection for Voids in Flexible Printed Board Materials

active, Most Current
Organization: IPC
Publication Date: 1 May 2012
Status: active
Page Count: 1

Document History

TM-650 2.1.13B
May 1, 2012
Inspection for Voids in Flexible Printed Board Materials
A description is not available for this item.
May 1, 1998
Inspection for Inclusions and Voids in Flexible Printed Wiring Materials
This method describes a procedure for quantifying the presence of inclusions and voids in flexible printed wiring materials.
July 1, 1993
Inspection for Inclusions and Voids in Flexible Printed Wiring Materials
A description is not available for this item.

References

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