IPC - TM-650 2.3.2G
Chemical Resistance of Flexible Printed Board Materials
active, Most Current
| Organization: | IPC |
| Publication Date: | 1 December 2007 |
| Status: | active |
| Page Count: | 3 |
scope:
To determine the effect of chemicals used in printed board fabrication on metal-clad and bare flexible dielectric materials. Caution: This test method uses hazardous chemicals to generate data. The person implementing this test method should refer to the appropriate Material Safety Data Sheet or equivalent for each chemical for safe operation.
Document History
TM-650 2.3.2G
December 1, 2007
Chemical Resistance of Flexible Printed Board Materials
To determine the effect of chemicals used in printed board fabrication on metal-clad and bare flexible dielectric materials. Caution: This test method uses hazardous chemicals to generate data. The...
May 1, 1998
Chemical Resistance of Flexible Printed Wiring Materials
A description is not available for this item.
January 1, 1993
Chemical Resistance of Flexible Printed Wiring Materials
A description is not available for this item.