IPC-4203
Cover and Bonding Material for Flexible Printed Circuitry
inactive
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| Organization: | IPC |
| Publication Date: | 1 October 2014 |
| Status: | inactive |
| Page Count: | 4 |
Document History
March 1, 2018
Cover and Bonding Material for Flexible Printed Circuitry
This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as...
IPC-4203
October 1, 2014
Cover and Bonding Material for Flexible Printed Circuitry
A description is not available for this item.
January 1, 2013
Cover and Bonding Material for Flexible Printed Circuitry
This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides which are to be used as...
May 1, 2002
Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films
This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one side, which are to be used as cover...