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IPC-7095

Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

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Organization: IPC
Publication Date: 1 June 2018
Status: active
Page Count: 208
scope:

This standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages.

Purpose

The purpose of this standard is to provide useful and practical information to those who use or are considering using BGAs. The target audiences for this document are managers, designers and process engineers who are responsible for design, assembly, inspection and repair processes of printed boards and printed board assemblies.

Document History

IPC-7095
June 1, 2018
Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
This standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design...
IPC-7095
January 1, 2013
Design and Assembly Process Implementation for BGAs
This document describes the design and assembly challenges for implementing Ball Grid Array (BGA) and Fine Pitch BGA (FBGA) technology. The effect of BGA and FBGA on current technology and component...
IPC-7095
March 1, 2008
Design and Assembly Process Implementation for BGAs
This document describes the design and assembly challenges for implementing Ball Grid Array (BGA) and Fine Pitch BGA (FBGA) technology. The effect of BGA and FBGA on current technology and component...
IPC-7095
October 1, 2004
Design and Assembly Process Implementation for BGAs
This document describes the design and assembly challenges for implementing Ball Grid Array (BGA) and Fine Pitch BGA (FBGA) technology. The effect of BGA and FBGA on current technology and component...
IPC-7095
August 1, 2000
Design and Assembly Process Implementation for BGAs
A description is not available for this item.

References

This document references:
IPC-A-610 - Acceptability of Electronic Assemblies
Published by IPC on October 1, 2017
This Standard is a collection of visual quality acceptability requirements for electronic assemblies. This Standard does not provide criteria for cross-section evaluation. This document presents...
This document references:
J-STD-001 - Automotive Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610G Acceptability of Electronic Assemblies
Published by IPC on February 1, 2020
This Addendum provides requirements to be used in addition to, and in some cases, in place of, those published in J-STD-001G and IPC-A-610G to ensure the reliability of mission-critical soldered...
This document references:
IPC-2221 - Generic Standard on Printed Board Design
Published by IPC on June 1, 2018
A description is not available for this item.
This document references:
IPC-A-610 - Acceptability of Electronic Assemblies
Published by IPC on October 1, 2017
This Standard is a collection of visual quality acceptability requirements for electronic assemblies. This Standard does not provide criteria for cross-section evaluation. This document presents...
This document references:
IPC-D-279 - Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
Published by IPC on July 1, 1996
This document establishes design concepts, guidelines, and procedures intended to promote appropriate ‘Design for Reliability (DfR)’ procedures and to ensure reliable printed wiring assembly (PWA)...
This document references:
T-50N - Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Published by IPC on November 1, 2021
This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing...
This document references:
1401A - Corporate Social Responsibility Management System Standard
Published by IPC on October 1, 2021
This standard specifies the requirements and best practice guidelines for an effective corporate social responsibility (CSR) management system to help an enterprise integrate CSR as a customer...
This document references:
IPC-2221 - Generic Standard on Printed Board Design
Published by IPC on June 1, 2018
A description is not available for this item.
This document references:
J-STD-001 - Automotive Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610G Acceptability of Electronic Assemblies
Published by IPC on February 1, 2020
This Addendum provides requirements to be used in addition to, and in some cases, in place of, those published in J-STD-001G and IPC-A-610G to ensure the reliability of mission-critical soldered...
This document is referenced by:
IPC-HDBK-001 - Handbook and Guide to Supplement J-STD-001
Published by IPC on January 1, 2021
This Handbook is a companion reference to the J-STD-001 (standard) and is intended to provide supporting information. Additional detailed information can be found in documents referenced within the...
This document is referenced by:
J-STD-001 REDLINE - Requirements for Soldered Electrical and Electronic Assemblies - Redline
Published by IPC on September 1, 2020
This standard describes materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies. The intent of this document is to rely on process control methodology...
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