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IPC-7095

Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

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Organization: IPC
Publication Date: 1 June 2018
Status: active
Page Count: 208
scope:

This standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages.

Purpose

The purpose of this standard is to provide useful and practical information to those who use or are considering using BGAs. The target audiences for this document are managers, designers and process engineers who are responsible for design, assembly, inspection and repair processes of printed boards and printed board assemblies.

Document History

IPC-7095
June 1, 2018
Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
This standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design...
IPC-7095
January 1, 2013
Design and Assembly Process Implementation for BGAs
This document describes the design and assembly challenges for implementing Ball Grid Array (BGA) and Fine Pitch BGA (FBGA) technology. The effect of BGA and FBGA on current technology and component...
IPC-7095
March 1, 2008
Design and Assembly Process Implementation for BGAs
This document describes the design and assembly challenges for implementing Ball Grid Array (BGA) and Fine Pitch BGA (FBGA) technology. The effect of BGA and FBGA on current technology and component...
IPC-7095
October 1, 2004
Design and Assembly Process Implementation for BGAs
This document describes the design and assembly challenges for implementing Ball Grid Array (BGA) and Fine Pitch BGA (FBGA) technology. The effect of BGA and FBGA on current technology and component...
IPC-7095
August 1, 2000
Design and Assembly Process Implementation for BGAs
A description is not available for this item.

References

This document references:
IPC-A-610 - Acceptability of Electronic Assemblies
Published by IPC on February 1, 2016
This standard is a collection of visual quality acceptability requirements for electronic assemblies. This standard does not provide criteria for cross-section evaluation This document presents...
This document references:
J-STD-001 - Requirements for Soldered Electrical and Electronic Assemblies
Published by IPC on September 1, 2018
A description is not available for this item.
This document references:
IPC-2221 - Generic Standard on Printed Board Design
Published by IPC on November 1, 2012
This standard establishes the generic requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures, including PC card form factors. The...
This document references:
IPC-A-610 - Acceptability of Electronic Assemblies
Published by IPC on February 1, 2016
This standard is a collection of visual quality acceptability requirements for electronic assemblies. This standard does not provide criteria for cross-section evaluation This document presents...
This document references:
IPC-D-279 - Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
Published by IPC on July 1, 1996
This document establishes design concepts, guidelines, and procedures intended to promote appropriate ‘Design for Reliability (DfR)’ procedures and to ensure reliable printed wiring assembly (PWA)...
This document references:
IPC-T-50 - Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Published by IPC on May 1, 2015
This document is designed to provide definitions for terms commonly used in the electronics industry which have meanings specific to electronics. The definitions are intended to provide sufficient...
This document references:
IPC-TM-650 - TEST METHODS MANUAL
Published by IPC on January 1, 2007
Introduction This manual establishes uniform methods for testing electronic and electrical parts including basic environmental, physical and electrical tests. These tests were developed to support...
This document references:
IPC-1401 - Corporate Social Responsibility and Sustainability Protocols for Electronic Manufacturing Industry
Published by IPC on March 1, 2017
This standard specifies the requirements and guidance for a supply chain social responsibility management system that an enterprise can use to integrate social responsibility into products and its...
This document references:
IPC-2221 - Generic Standard on Printed Board Design
Published by IPC on November 1, 2012
This standard establishes the generic requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures, including PC card form factors. The...
This document references:
J-STD-001 - Requirements for Soldered Electrical and Electronic Assemblies
Published by IPC on September 1, 2018
A description is not available for this item.
This document is referenced by:
IPC-HDBK-001 - Handbook and Guide to Supplement J-STD-001
Published by IPC on February 1, 2016
This Handbook is a companion reference to the J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies (Standard) and is intended to provide supporting information. Additional...
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