Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
|Publication Date:||1 June 2018|
This standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages.
The purpose of this standard is to provide useful and practical information to those who use or are considering using BGAs. The target audiences for this document are managers, designers and process engineers who are responsible for design, assembly, inspection and repair processes of printed boards and printed board assemblies.