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IPC-7095

Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

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Organization: IPC
Publication Date: 1 June 2018
Status: active
Page Count: 208
scope:

This standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages.

Purpose

The purpose of this standard is to provide useful and practical information to those who use or are considering using BGAs. The target audiences for this document are managers, designers and process engineers who are responsible for design, assembly, inspection and repair processes of printed boards and printed board assemblies.

Document History

IPC-7095
June 1, 2018
Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
This standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design...
January 1, 2013
Design and Assembly Process Implementation for BGAs
This document describes the design and assembly challenges for implementing Ball Grid Array (BGA) and Fine Pitch BGA (FBGA) technology. The effect of BGA and FBGA on current technology and component...
March 1, 2008
Design and Assembly Process Implementation for BGAs
This document describes the design and assembly challenges for implementing Ball Grid Array (BGA) and Fine Pitch BGA (FBGA) technology. The effect of BGA and FBGA on current technology and component...
October 1, 2004
Design and Assembly Process Implementation for BGAs
This document describes the design and assembly challenges for implementing Ball Grid Array (BGA) and Fine Pitch BGA (FBGA) technology. The effect of BGA and FBGA on current technology and component...
August 1, 2000
Design and Assembly Process Implementation for BGAs
A description is not available for this item.

References

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