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IPC-7095

Design and Assembly Process Implementation for BGAs

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Organization: IPC
Publication Date: 1 August 2000
Status: inactive
Page Count: 88

Document History

June 1, 2018
Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
This standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design...
January 1, 2013
Design and Assembly Process Implementation for BGAs
This document describes the design and assembly challenges for implementing Ball Grid Array (BGA) and Fine Pitch BGA (FBGA) technology. The effect of BGA and FBGA on current technology and component...
March 1, 2008
Design and Assembly Process Implementation for BGAs
This document describes the design and assembly challenges for implementing Ball Grid Array (BGA) and Fine Pitch BGA (FBGA) technology. The effect of BGA and FBGA on current technology and component...
October 1, 2004
Design and Assembly Process Implementation for BGAs
This document describes the design and assembly challenges for implementing Ball Grid Array (BGA) and Fine Pitch BGA (FBGA) technology. The effect of BGA and FBGA on current technology and component...
IPC-7095
August 1, 2000
Design and Assembly Process Implementation for BGAs
A description is not available for this item.
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