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JEDEC JESD 22-A104

Temperature Cycling

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Organization: JEDEC
Publication Date: 1 July 2000
Status: inactive
Page Count: 14

Document History

November 1, 2020
Temperature Cycling
This standard applies to single-, dual- and triple-chamber temperature cycling in an air or other gaseous medium and covers component and solder interconnection testing. In single chamber cycling,...
October 1, 2014
Temperature Cycling
This standard applies to single-, dual- and triple-chamber temperature cycling and covers component and solder interconnection testing. It should be noted that this standard does not cover or apply...
March 1, 2009
Temperature Cycling
This standard provides a method for determining solid state devices capability to withstand extreme temperature cycling. Changes in this revision include requirements that the worst-case load...
May 1, 2005
Temperature Cycling
A description is not available for this item.
JEDEC JESD 22-A104
July 1, 2000
Temperature Cycling
A description is not available for this item.
December 1, 1989
Temperature Cycling (Revision of Test Method A104 - Previously Published in JESD22-B)
A description is not available for this item.
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