Electroless Nickel Plating Standards

This specification covers the requirements for electroless nickel deposited on various materials.

This specification covers the requirements for electroless nickel plate that is codeposited with polytetrafluoroethylene (PTFE) over other materials.

This specification covers the engineering requirements for electroless nickel deposited on various materials.

This specification covers the engineering requirements for electroless deposition of a nickel-thallium-boron coating on various substrates and properties of the deposit.

This specification covers the engineering requirements for electroless nickel deposited on various materials.

1.1 This guide describes two processes used for plating on magnesium and magnesium alloys: direct electroless nickel plating and zinc immersion. Some users report that the direct electroless nickel procedure does not produce quite as high a level of...

This specification covers the requirements for an electroless nickel-thallium-boron or nickel-boron, deposit on various substrates.

Statement of Scope This performance specification sets requirements for Electroless Nickel/Immersion Gold (ENIG) deposit thicknesses for applications including soldering, wire bonding and as a contact finish. It is intended for use by chemical suppliers, printed board manufacturers,...

These specifications define the performance characteristics of acceptable electroless nickel-phosphorus alloy platings for metallic substrates, in either the heat treated or as deposited condition. The coating process shall be lead and cadmium free.

1.1 This specification covers requirements for autocatalytic (electroless) nickel-phosphorus coatings applied from aqueous solutions to metallic products for engineering (functional) uses. 1.2 The coatings are alloys of nickel and phosphorus produced by autocatalytic chemical...

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1.1 This specification covers requirements for autocatalytic (electroless) nickel-phosphorus coatings applied from aqueous solutions to metallic products for engineering (functional) uses. 1.2 The coatings are alloys of nickel and phosphorus produced by autocatalytic chemical...

These specifications define the performance characteristics of acceptable electroless nickelphosphorus alloy platings for metallic substrates, in either the heat treated or as deposited condition. The coating process shall be lead and cadmium free.

1.1 This specification covers the requirements for electrodeposited coatings of titanium and titanium-zirconium alloys on conductive and non-conductive substrates for engineering (functional) uses. The coatings of titanium-zirconium alloys are those that range in zirconium between 10wt% and 14wt%...

This standard contains the requirements for autocatalytic nickel boron alloy coatings deposited from aqueous solutions without the use of external electric sources. The specification classifies the hard, uniform, microporous, and limited corrosion protection coatings as either Type 1 or Type...

This specification defines the performance characteristics of an acceptable electroless nickel plated coating.

1.1 This guide describes two processes used for plating on magnesium and magnesium alloys: direct electroless nickel plating and zinc immersion. Some users report that the direct electroless nickel procedure does not produce quite as high a level of...

This specification sets the requirements for the use of Electroless Nickel/Immersion Gold (ENIG) as a surface finish for printed circuit boards. This specification is intended to set requirements for ENIG deposit thicknesses based on performance criteria. It is intended for use by...

A description is not available for this item.

This specification covers the requirements for an electroless nickel-thallium-boron or nickel-boron deposit on various substrates.