Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
|Publication Date:||1 October 2002|
This specification sets the requirements for the use of Electroless Nickel/Immersion Gold (ENIG) as a surface finish for printed circuit boards. This specification is intended to set requirements for ENIG deposit thicknesses based on performance criteria. It is intended for use by supplier, printed circuit manufacturer, electronics manufacturing services (EMS) and original equipment manufacturer (OEM).