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PCB Board Standards

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DSF/FPREN IEC 60947-7-4 - Low-voltage switchgear and controlgear – Part 7-4: Ancillary equipment – PCB terminal blocks for copper conductors
DS

This part of IEC 60947 specifies requirements for PCB terminal blocks primarily intended for industrial or similar use. Mounting and fixing on the printed circuit board is made by soldering, press-in or equivalent methods to provide electrical and mechanical connection between copper...

DSF/PREN 60947-7-4 - Low-voltage switchgear and controlgear – Part 7-4: Ancillary equipment – PCB terminal blocks for copper conductors
DS

This part of IEC 60947 specifies requirements for PCB terminal blocks primarily intended for industrial or similar use. Mounting and fixing on the printed circuit board is made by soldering, press-in or equivalent methods to provide electrical and mechanical connection between copper...

IPC-1065 - Material Declaration Handbook
January 1, 2005 - IPC

This handbook has been developed to aid Printed Circuit Board manufacturers and users of Printed Circuit Boards in completing Material Declarations that follow the format and guidance of the Joint Industry Material Composition Declaration Guide for Electronic Products. Purpose This...

BS DD ENV 1798 - Paper and Board Intended to Come into Contact with Foodstuffs - Determination of Seven Specified Polychlorinated Biphenyls (PCB)
February 15, 1996 - BSI
A description is not available for this item.
IPC-TA-724 - Technology Assessment Series on Cleanrooms
April 1, 1998 - IPC

Overview The continuing trend to finer features on PCBs increased the negative effect of particles on board yields. Cleanrooms provide a logical way to reduce the effect of particles, and are more critical as finer lines are required. Cleanrooms have been used since at least the 1970s...

IPC-TM-650 2.5.5.7 - Characteristic Impedance of Lines on Printed Boards by TDR
March 1, 2004 - IPC

This document describes time domain reflectometry (TDR) methods for measuring and calculating the characteristic impedance, Z(0), of a transmission line on a printed circuit board (PCB). In TDR, a signal, usually a step pulse, is injected onto a transmission line and the Z(0) of the...

DSF/PREN IEC 60749-37 - Semiconductor devices – Mechanical and climatic test methods – Part 37: Board level drop test method using an accelerometer
DS

This part of IEC 60749 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure....

DSF/ISO/FDIS 11452-4 - Road vehicles – Component test methods for electrical disturbances from narrowband radiated electromagnetic energy – Part 4: Harness excitation methods
DS

This part of ISO 11452 specifies harness excitation test methods and procedures for determining the immunity of electronic components of passenger cars and commercial vehicles regardless of the propulsion system (e.g. spark-ignition engine, diesel engine, electric motor). The bulk current injection...

IPC/JPCA-4104 - Specification for High Density Interconnect (HDI) and Microvia Materials
May 1, 1999 - IPC

This document describes various materials that can be used for the fabrication of high density interconnection (HDI) and microvias. It provides information on general classifications and associated characteristics of HDI materials. The document shall be used as a qualification and conformance...

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