BSI - BS EN 61189-3-719
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3-719: Test methods for interconnection structures (printed boards) — Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
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| Organization: | BSI |
| Publication Date: | 30 April 2016 |
| Status: | active |
| Page Count: | 18 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
BS EN 61189-3-719
April 30, 2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3-719: Test methods for interconnection structures (printed boards) — Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
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