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JEDEC JEP 130

Guidelines for Packing and Labeling of Integrated Circuits in Unit Container Packing (Tubes, Trays, and Tape and Reel)

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Organization: JEDEC
Publication Date: 1 November 2016
Status: active
Page Count: 14
scope:

This document establishes the guidelines for unit container packing of integrated circuits and for the next level of container.

Document History

JEDEC JEP 130
November 1, 2016
Guidelines for Packing and Labeling of Integrated Circuits in Unit Container Packing (Tubes, Trays, and Tape and Reel)
This document establishes the guidelines for unit container packing of integrated circuits and for the next level of container.
February 1, 2006
Guidelines for Packing and Labeling of Integrated Circuits in Unit Container Packing (Tubes, Trays, and Tape and Reel)
This document establishes guidelines for integrated circuit unit container and the next level (intermediate) container packing and labeling. The guidelines include tube/rail standardization,...
August 1, 1997
Guidelines for Packing and Labeling of Integrated Circuits in Unit Container Packing
A description is not available for this item.

References

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