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JEDEC JESD 22-B106

Resistance to Solder Shock for Through-Hole Mounted Devices

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Organization: JEDEC
Publication Date: 1 November 2016
Status: active
Page Count: 14
scope:

This test method is used to determine whether solid state devices can withstand the effect of the temperature shock to which they will be subjected during soldering of their leads in a solderwave process and/or solder fountain (rework/replacement) process. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board.

This test method shall not be used to simulate wave soldering of surface mount device packages that are glued onto the same side of the board as the solder wave and are fully submerged into the solder wave. The test method for simulating SMT devices through the wave is JESD22-A111, Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State Devices.

In order to establish a standard test procedure for the most reproducible methods, the solder dip method is used because of its more controllable conditions. This procedure will determine whether devices are capable of withstanding the soldering temperature encountered in printed wiring board assembly operations, without degrading their electrical characteristics or internal connections. This test is destructive and may be used for qualification, lot acceptance and as a product monitor.

Document History

JEDEC JESD 22-B106
November 1, 2016
Resistance to Solder Shock for Through-Hole Mounted Devices
This test method is used to determine whether solid state devices can withstand the effect of the temperature shock to which they will be subjected during soldering of their leads in a solderwave...
April 1, 2008
Resistance to Solder Shock for Through-Hole Mounted Devices
A description is not available for this item.
February 1, 2005
Test Method B106C Resistance to Soldering Temperature for Through-Hole Mounted Devices
A description is not available for this item.
February 1, 1999
Test Method B106-B Resistance to Soldering Temperature for Through-Hole Mounted Devices
A description is not available for this item.
January 1, 1989
Resistance to Soldering Temperature for Through-Hole Mounted Devices (Revision of Test Method B106 - Previously Published in JESD22-B)
A description is not available for this item.

References

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