JEDEC JESD 22-B106
Test Method B106C Resistance to Soldering Temperature for Through-Hole Mounted Devices
inactive
Buy Now
| Organization: | JEDEC |
| Publication Date: | 1 February 2005 |
| Status: | inactive |
| Page Count: | 10 |
Document History
November 1, 2016
Resistance to Solder Shock for Through-Hole Mounted Devices
This test method is used to determine whether solid state devices can withstand the effect of the temperature shock to which they will be subjected during soldering of their leads in a solderwave...
April 1, 2008
Resistance to Solder Shock for Through-Hole Mounted Devices
A description is not available for this item.
JEDEC JESD 22-B106
February 1, 2005
Test Method B106C Resistance to Soldering Temperature for Through-Hole Mounted Devices
A description is not available for this item.
February 1, 1999
Test Method B106-B Resistance to Soldering Temperature for Through-Hole Mounted Devices
A description is not available for this item.
January 1, 1989
Resistance to Soldering Temperature for Through-Hole Mounted Devices (Revision of Test Method B106 - Previously Published in JESD22-B)
A description is not available for this item.