CENELEC - EN 60191-6-13
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Finepitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
active, Most Current
| Organization: | CENELEC |
| Publication Date: | 1 November 2016 |
| Status: | active |
| Page Count: | 24 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
This part of IEC 60191 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA.
Document History
EN 60191-6-13
November 1, 2016
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Finepitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
This part of IEC 60191 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC...
November 1, 2007
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
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