IEC 60191-6
Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
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| Organization: | IEC |
| Publication Date: | 1 November 2009 |
| Status: | active |
| Page Count: | 80 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
This part of IEC 60191 gives general rules for the preparation of outline drawings of surfacemounted semiconductor devices. It supplements IEC 60191-1 and IEC 60191-3. It covers all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8, as well as integrated circuits classified as form E in Clause 3 of IEC 60191-4.
Document History
IEC 60191-6
November 1, 2009
Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
This part of IEC 60191 gives general rules for the preparation of outline drawings of surfacemounted semiconductor devices. It supplements IEC 60191-1 and IEC 60191-3. It covers all surface-mounted...
September 1, 2004
Mechanical Standardization of Semiconductor Devices - Part 6: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages
A description is not available for this item.
December 1, 1990
Mechanical Standardization of Semiconductor Devices - Part 6: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages
A description is not available for this item.