BSI - BS EN 60191-6-21
Mechanical standardization of semiconductor devices Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
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| Organization: | BSI |
| Publication Date: | 31 December 2010 |
| Status: | active |
| Page Count: | 18 |
| ICS Code (Networking): | 35.110 |
| ICS Code (Industrial process measurement and control): | 25.040.40 |
| ICS Code (Multilayer applications): | 35.100.05 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
BS EN 60191-6-21
December 31, 2010
Mechanical standardization of semiconductor devices Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
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