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BSI - BS EN 60191-6

Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

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Organization: BSI
Publication Date: 30 April 2010
Status: active
Page Count: 42
ICS Code (Semiconductor devices in general): 31.080.01

Document History

BS EN 60191-6
April 30, 2010
Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
A description is not available for this item.
BS EN 60191-6
February 18, 2005
Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
A description is not available for this item.

References

This document references:
IEC 60191-1 - Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
Published by IEC on January 1, 2018
This part of IEC 60191 gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8. For the...
This document references:
BS EN ISO 1101 - Geometrical Product Specifications (GPS) — Geometrical tolerancing — Tolerances of form, orientation, location and run-out
Published by BSI on February 28, 2017
A description is not available for this item.
This document references:
IEC 60191-3 - Mechanical Standardization of Semiconductor Devices - Part 3: General Rules for the Preparation of Outline Drawings of Integrated Circuits
Published by IEC on October 1, 1999
A description is not available for this item.
This document references:
IEC 60191-2 - Amendment 16 Mechanical Standardization of Semiconductor Devices - Part 2: Dimensions
Published by IEC on July 1, 2007
A description is not available for this item.
This document references:
EN ISO 1101 - Geometrical product specifications (GPS) - Geometrical tolerancing - Tolerances of form, orientation, location and run-out
Published by CEN on February 1, 2017
This document defines the symbol language for geometrical specification of workpieces and the rules for its interpretation. It provides the foundation for geometrical specification. The illustrations...
This document is referenced by:
BS EN 60191-6-18 - Mechanical standardization of semiconductor devices Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Published by BSI on April 30, 2010
A description is not available for this item.
This document is referenced by:
BS EN 60191-6-21 - Mechanical standardization of semiconductor devices Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
Published by BSI on December 31, 2010
A description is not available for this item.
This document is referenced by:
BS EN 60191-6-20 - Mechanical standardization of semiconductor devices Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
Published by BSI on December 31, 2010
A description is not available for this item.
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