BSI - BS EN 60191-6-20
Mechanical standardization of semiconductor devices Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
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| Organization: | BSI |
| Publication Date: | 31 December 2010 |
| Status: | active |
| Page Count: | 16 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
BS EN 60191-6-20
December 31, 2010
Mechanical standardization of semiconductor devices Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
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