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IEC 60191-4

Mechanical Standardization of Semiconductor Devices - Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages

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Organization: IEC
Publication Date: 1 March 2018
Status: active
Page Count: 158
ICS Code (Semiconductor devices in general): 31.080.01
scope:

This part of IEC 60191 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages.

The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability.

Document History

IEC 60191-4
March 1, 2018
Mechanical Standardization of Semiconductor Devices - Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
This part of IEC 60191 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for...
March 1, 2018
AMENDMENT 1 Mechanical Standardization of Semiconductor Devices - Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
A description is not available for this item.
October 1, 2002
Mechanical Standardization of Semiconductor Devices - Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
A description is not available for this item.
October 1, 2002
Mechanical Standardization of Semiconductor Devices - Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
This part of IEC 60191 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for...
July 1, 2002
Mechanical Standardization of Semiconductor Devices Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
A description is not available for this item.
October 1, 1999
Mechanical Standardization of Semiconductor Devices Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
A description is not available for this item.
January 1, 1987
Mechanical Standardization of Semiconductor Devices Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Devices
A description is not available for this item.

References

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