IEC 60191-4
Mechanical Standardization of Semiconductor Devices Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Devices
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| Organization: | IEC |
| Publication Date: | 1 January 1987 |
| Status: | inactive |
| Page Count: | 13 |
Document History
March 1, 2018
Mechanical Standardization of Semiconductor Devices - Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
This part of IEC 60191 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for...
March 1, 2018
AMENDMENT 1 Mechanical Standardization of Semiconductor Devices - Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
A description is not available for this item.
October 1, 2002
Mechanical Standardization of Semiconductor Devices - Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
This part of IEC 60191 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for...
October 1, 2002
Mechanical Standardization of Semiconductor Devices - Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
A description is not available for this item.
July 1, 2002
Mechanical Standardization of Semiconductor Devices Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
A description is not available for this item.
October 1, 1999
Mechanical Standardization of Semiconductor Devices Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
A description is not available for this item.
IEC 60191-4
January 1, 1987
Mechanical Standardization of Semiconductor Devices Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Devices
A description is not available for this item.