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IEC 60191-4

Mechanical Standardization of Semiconductor Devices - Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages

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Organization: IEC
Publication Date: 1 October 2002
Status: inactive
Page Count: 52
ICS Code (Semiconductor devices): 31.080
ICS Code (Semiconductor devices in general): 31.080.01

Document History

IEC 60191-4
March 1, 2018
Mechanical Standardization of Semiconductor Devices - Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
This part of IEC 60191 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for...
IEC 60191-4
March 1, 2018
AMENDMENT 1 Mechanical Standardization of Semiconductor Devices - Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
A description is not available for this item.
IEC 60191-4
October 1, 2002
Mechanical Standardization of Semiconductor Devices - Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
A description is not available for this item.
IEC 60191-4
October 1, 2002
Mechanical Standardization of Semiconductor Devices - Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
This part of IEC 60191 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for...
60191-4 AMD 2
July 1, 2002
Mechanical Standardization of Semiconductor Devices Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
A description is not available for this item.
IEC 60191-4
October 1, 1999
Mechanical Standardization of Semiconductor Devices Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
A description is not available for this item.
IEC 60191-4
January 1, 1987
Mechanical Standardization of Semiconductor Devices Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Devices
A description is not available for this item.
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References

This document is referenced by:
IEC 61360-1 - Standard data element types with associated classification scheme – Part 1: Definitions – Principles and methods
Published by IEC on July 1, 2017
This part of IEC 61360 specifies principles for the definition of the properties and associated attributes and explains the methods for representing verbally defined concepts with appropriate data...
This document is referenced by:
IEC 60191-6-21 - Mechanical standardization of semiconductor devices – Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline packages (SOP)
Published by IEC on August 1, 2010
This part of IEC 60191 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.
This document is referenced by:
CEI EN 60191-6-12 - Mechanical standardization of semiconductor devices Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
Published by CEI on June 1, 2012
This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less.
This document is referenced by:
BS EN 60191-6-2 - Mechanical Standardization of Semiconductor Devices - Part 6-2: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for 1,50 mm, 1,27 mm and 1,00 mm Pitch Ball and Column Terminal Packages
Published by BSI on March 29, 2002
A description is not available for this item.
This document is referenced by:
CEI EN 62149-7 - Fibre optic active components and devices - Performance standards Part 7: 1 310 nm discrete vertical cavity surface emitting laser devices
Published by CEI on March 1, 2013
This part of IEC 62149 covers the performance specification for 1 310-nm discrete vertical cavity surface emitting laser (VCSEL) devices of transverse single-mode and multimode types used for the...
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