IEC - 60191-4 AMD 2
Mechanical Standardization of Semiconductor Devices Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
inactive
| Organization: | IEC |
| Publication Date: | 1 July 2002 |
| Status: | inactive |
| Page Count: | 58 |
Document History
March 1, 2018
Mechanical Standardization of Semiconductor Devices - Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
This part of IEC 60191 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for...
March 1, 2018
AMENDMENT 1 Mechanical Standardization of Semiconductor Devices - Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
A description is not available for this item.
October 1, 2002
Mechanical Standardization of Semiconductor Devices - Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
This part of IEC 60191 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for...
October 1, 2002
Mechanical Standardization of Semiconductor Devices - Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
A description is not available for this item.
60191-4 AMD 2
July 1, 2002
Mechanical Standardization of Semiconductor Devices Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
A description is not available for this item.
October 1, 1999
Mechanical Standardization of Semiconductor Devices Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
A description is not available for this item.
January 1, 1987
Mechanical Standardization of Semiconductor Devices Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Devices
A description is not available for this item.