CEI EN 60191-6-12
Mechanical standardization of semiconductor devices Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
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| Organization: | CEI |
| Publication Date: | 1 June 2012 |
| Status: | active |
| Page Count: | 26 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less.
Document History
CEI EN 60191-6-12
June 1, 2012
Mechanical standardization of semiconductor devices Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less.
December 1, 2002
Mechanical standardization of semiconductor devices Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type
Norma recepita mediante l'annuncio su CEINFORMA dicembre 2002.