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IEC 60191-5

Mechanical Standardization of Semiconductor Devices - Part 5: Recommendations Applying to Integrated Circuit Packages Using Tape Automated Bonding (TAB)

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Organization: IEC
Publication Date: 1 April 1997
Status: active
Page Count: 82
ICS Code (Semiconductor devices): 31.080

Document History

IEC 60191-5
April 1, 1997
Mechanical Standardization of Semiconductor Devices - Part 5: Recommendations Applying to Integrated Circuit Packages Using Tape Automated Bonding (TAB)
A description is not available for this item.
IEC 60191-5
January 1, 1987
Mechanical Standardization of Semiconductor Devices Part 5: Recommendations Applying to Tape Automated Bonding (TAB) of Integrated Circuits First Edition
A description is not available for this item.

References

This document is referenced by:
CEI EN 60191-6-12 - Mechanical standardization of semiconductor devices Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
Published by CEI on June 1, 2012
This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less.
This document is referenced by:
BS EN 60191-6-2 - Mechanical Standardization of Semiconductor Devices - Part 6-2: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for 1,50 mm, 1,27 mm and 1,00 mm Pitch Ball and Column Terminal Packages
Published by BSI on March 29, 2002
A description is not available for this item.
This document is referenced by:
CEI EN 62149-7 - Fibre optic active components and devices - Performance standards Part 7: 1 310 nm discrete vertical cavity surface emitting laser devices
Published by CEI on March 1, 2013
This part of IEC 62149 covers the performance specification for 1 310-nm discrete vertical cavity surface emitting laser (VCSEL) devices of transverse single-mode and multimode types used for the...
This document is referenced by:
BS EN 153000 - Harmonized System of Quality Assessment for Electronic Components General Specification: Discrete Pressure Contact Power Semiconductor Devices (Qualification Approval)
Published by BSI on July 15, 1998
Applies to rectifier diodes, transistors, thyristors and their derivatives. The requirements also cover encapsulated assemblies but not to stacks or assemblies made with these encapsulated components.
This document is referenced by:
IEC 62148-15 - Fibre optic active components and devices – Package and interface standards – Part 15: Discrete vertical cavity surface emitting laser packages
Published by IEC on March 1, 2021
This part of IEC 62148 covers the physical dimension and interface specifications for discrete vertical cavity surface emitting laser (VCSEL) devices in optical telecommunication and optical data...
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