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IEC 60191-5

Mechanical Standardization of Semiconductor Devices - Part 5: Recommendations Applying to Integrated Circuit Packages Using Tape Automated Bonding (TAB)

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Organization: IEC
Publication Date: 1 April 1997
Status: active
Page Count: 82
ICS Code (Semiconductor devices): 31.080

Document History

IEC 60191-5
April 1, 1997
Mechanical Standardization of Semiconductor Devices - Part 5: Recommendations Applying to Integrated Circuit Packages Using Tape Automated Bonding (TAB)
A description is not available for this item.
January 1, 1987
Mechanical Standardization of Semiconductor Devices Part 5: Recommendations Applying to Tape Automated Bonding (TAB) of Integrated Circuits First Edition
A description is not available for this item.

References

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