IEC 60191-5
Mechanical Standardization of Semiconductor Devices Part 5: Recommendations Applying to Tape Automated Bonding (TAB) of Integrated Circuits First Edition
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| Organization: | IEC |
| Publication Date: | 1 January 1987 |
| Status: | inactive |
| Page Count: | 29 |
| ICS Code (Semiconductor devices): | 31.080 |
Document History
April 1, 1997
Mechanical Standardization of Semiconductor Devices - Part 5: Recommendations Applying to Integrated Circuit Packages Using Tape Automated Bonding (TAB)
A description is not available for this item.
IEC 60191-5
January 1, 1987
Mechanical Standardization of Semiconductor Devices Part 5: Recommendations Applying to Tape Automated Bonding (TAB) of Integrated Circuits First Edition
A description is not available for this item.